Wafer front-side pack/unpacking
For thin, standard and bonded wafers
For multi separator types
Safe wafer handling
Economical and compact
More about Prelude
It features handling wafers of 4”~12” in size (with little of no change over required) and 300~ 1900 µm in thickness; our vortex solution handles 50~800 µm for thin warped wafers (max warpage 8mm). Special intelligence is designed to safely pick, map, align and capture ID for special wafers of wide range. .. (more)
The Prelude AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free...(more)
mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers....(more)
Sapphire Wafer HandlingFor thick wafer handliing in a standard pitched cassette 
Wafer Jar Packing
For thin, standard and thick wafers' front-side pack/unpack 
Wafer Stacking
An alternative for temperary or permanent chemical bonding 
6-axis Robot Wafer Handling
custom automation and tool desing engineering 
Safe Wafer Flipping
Absolute encoded flipper with edge grip end effector 
Jar Sepatator Handling
Optical devices to detect different colors or materials 
Fixturing for Automation
Upgrade your current fixture to be automation friendly 
Tooling & Miniature Manufacturing
In-house high precison manufacturing for a fast prototyping 2018 © QUARTET MECHANICS INC. All Rights Reserved.
