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- PRELUDE WAFER PACKING
STARTING BACK-END PROCESSING THE RIGHT WAY
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Slide background 3 FOUP WAFER SORTER High-speed robot with double end-effectors,
dual aligner and dual OCR
Available FOUP, FOSB, SMIF and cassette Repeatability: 50μm/0.03° HEPA-High Efficiency Particulate Air Fan Filter Untis Slider Image
Slide background MICROSCOPE LOADER
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Slide background HIGH PECISION WAFER/
CHIP MARKER & SORTER
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Unlimited Wafer Handling Possibilities

Robotic automation with micron-level precision and repeatability for the handling, alignment, and placement of most delicate substrates.

WAFER SORTING

It features handling wafers of 4”~12” in size (with little to no change over required) and 300~1900 µm in thickness; our vortex solution handles 50~800 µm for thin warped wafers (max warpage 8mm). Special intelligence is designed to safely pick, map, align and capture ID for special wafers of wide range. .. (more)

WAFER PACKING

The Prelude AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free...(more)

WAFER STACKING

Mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers....(more)