It features handling wafers of 4”~12” in size and 300~1900µm in thickness; our vortex solution handles 50~800µm for thin warped wafers (max warpage 8mm). Special intelligence is designed to safely pick, map, align and capture ID for special wafers of wide range... (more)
The loader is featured by a versatile platform that accommodates all sorts of carriers (FOUP/FOSB/SMIF/cassette). It also features a 270-degree self-tilting function for a complete macro inspection of the wafer's front and back surface....(more)
The loader is featured by a versatile platform that accommodates all sorts of carriers (FOUP/FOSB/SMIF/cassette). It also features a 270-degree self-tilting function for a complete macro inspection of the wafer's front and back surface...(more)
The Prelude AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free...(more)
The Prelude AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free...(more)
Mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers....(more)