With home-grown component, we handle wafers of size 4”~12” & thinkness 50~1800µm; our vortex (Bernoulli) edge gripper handles thin wafers upto 8mm warpage . Special intelligence is designed in to safely hanlde delicate wafers...(more)
A highly flexible, configurable hardware and software platform, permitting versatile Sorter/EFEM to accommodates multi type carriers (FOUP/FOSB/SMIF/cassette) and multi type/size wafers ...(more)
The OM loader features macro inspection that allows wafer's front/back side and edge visual inspecting, regardless of wafer material and thickness; it can be customized for most model of microscope on market ...(more)
The Prelude AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free...(more)
With our high-accuracy wafer alignment and placement component, we bring Keyence Laser Marking Module to a fully automatic, high throughput and cost effective Wafer ID marking system ...(more)
Mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers....(more)