Prelude Wafer (Un)packer

• Handles special wafers including 50 to 1900 µm thick or perforated; allowable wafer distortion: up to 8mm.
• 4”, 6”, 8” or 12” in size; multi wafer size bridge available
• 2 jar ports and 1 cassette/SMIF or auto FOUP ports, detect carrier presence; detect empty double or cross slotted wafer, FFU/Ionizer and additional ports available
• Wafer prealign (vacuum + edge grip or edge grip only)
• OCR support for top, bottom, or both. Most common codes supported
• Sorting (merge/split/transfer) and flipping
• Software driven or manual manipulated operation; SECS/GEM communication

Support wafer jar pack/unpack with top approach available only

• SAFE UNPACKING: equipped with same vortex and SoftTouch mechanism(jar)
~120 WPH