Enabling fragile wafer mid-end processing
BONDLESS PRECISION WAFER STACKING
Temporary bonding is used by mid-end processing manufacturers to handle thinned wafers. However, it has limited temperature budget and the chemical can sometimes cause yield issues.
Quartet Mechanics offers MEMS (Microelectromechanical systems) manufacturers’ mid-end processing a wafer vehicle free from the traditional chemical bonding. This novel mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers.