Bondless Precision Wafer Stacking

Cost effective fully automated wafer alignment and insertion of wafer or wafers stacks into fixturing for paste dispensing, low temperature bake, deposition processes and wafer dicing

• Device & handle wafers are aligned and ID captured
• Device wafer then moved to insert to fixture with ± 5 µm precision
• Fixture can be used for masking or dicing

While fixturing is not allowed for processes such as high temperature bake and etch processes specialized robotic end effectors load wafer stacks to quartz boats for bake or etch operations while maintaining alignment

• Device & handle wafers are aligned and ID captured prior to stacking
• Optional auto wafer clipping/unclipping available