Single tool for multi size, thickness and warpage


HIGH PECISION WAFER/CHIP MARKER


QM's Dynamics Marker(DM-200 & DM-300)series CO2 laser marking/scribing/sorting system is equipped with a 3-axis simultaneous laser control system that creats precise marking and improves the accuracy of markers on large flat surfaces.

The utilization of non-contact edge grip end effector and edge-grip aligner with our proprietary SoftTouch gripping mechanism ensures damage and contamination free wafer transfers.

System Feature

  • For 200 or 300mm, thin or thick, silicon, glass or compound substrates
  • Contactless handling, contamination free
  • High precision marking, less area needed
  • Chip ID marking, uniform spot size covers, 300x300mm wide area
  • For fine-line standard or custom font, image, bar code/2D matrix & scribinh
  • High configurable platform, up to 6 ports/200mm, 4 ports/300mm for wafer sorting

Product Demonstration


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Quartet Mechanics Introduction (PDF)
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Bondless Wafer Stacking (PDF)
English
中文-简体
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