Slide background Slider Image Slider image No more chemicals!!
Bondless- A new way for wafer stacking
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Slide background Wafer front-side pack/unpacking For thin, standard and bonded wafers For multi separator types Safe wafer handling Economical and compact More about Prelude Slider Image
Slide background For delicate wafers:
Stress-free handling solution
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Unlimited Wafer Handling Possibilities

Robotic automation with micron-level precision and repeatability for the handling, alignment, and placement of most delicate substrates.


It features handling wafers of 4”~12” in size (with little of no change over required) and 300~ 1900 µm in thickness; our vortex solution handles 50~800 µm for thin warped wafers (max warpage 8mm). Special intelligence is designed to safely pick, map, align and capture ID for special wafers of wide range. .. (more)


The AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free(more)


mechanical-based fragile wafer stacking solution features high precision alignment (± 5 µm); high yield is reached with its intelligent vision-guided robotic transferring and fixturing that prevents damage of delicate thin, warped or perforated wafers. ...(more)