Edge Grip End Effector
SoftTouch mechanism with programmable gripping force enables the gripping tips to gently touch the wafer on the exclusion zone only thus minimizing particle generation while maintaining a secure hold.
Substrate: Top- or bottom-pick, handles from 50~1900 µm thick substrates, round or square (vortex type available for ultra thin, warped and potato-chip like wafers)
Options: include self-centering, waterproof, high temperature, and integrated mapping/presence sensor
Wafer Aligner
Vacuum grip: Offer high speed capability with ~2-second aligning time. The prealigner can handle 50 to 300mm with either software driven (no change-over) or manual (5-min change-over) adjusting. It can automatically recognize notches, flats and double flats on standard semi- or transparent or potato-chip like wafers.
Edge grip: The IEG Aligner 200mm and 300mm comes with our edge grip self-centering feature that allows you to achieve significantly higher reliability and helps minimize particle creation associated with friction during wafer shifts and drops. As with all of our wafer-handling products, the IEG Aligner has been proven to have absolutely no back side contamination.
Vacuum-edge hybrid: Hybrid vacuum and SoftTouch edge grip prealigner for thin and warped wafers
Robot
3~5 axis: Depending on project application and budget, appropriate clean room robot model will be selected. All robots are proven to have high reliability and low maintenance cost. For a seamless integration and easy customization our in-house robot, CE and ISO class 1 certified, will be recommended.
6-axis: Working with our partner to offer custom tool uliizing 6-axis robot
Detection
Through beam: Our home-grown precision through-beam sensors are specially designed for wafer mapping, aligning and positioning. They are designed to prevent production line stoppages and expensive crashes by identifying ALL wafer misplacements - stacked, cross-slotted and empty slots, especiallly compatible for wafer such as compound or thin/warped wafers.
Detection module: Many sub-systems are modulized, such as carrier presence adn wafer protusion, wafer presenxe, wafer vs. interleaf detection or high precision alignment module
