PRELUDE WAFER TOP PICK (UN)PACKER
Quartet Mechanics Prelude AWP family of wafer packing systems provides superior performance at an affordable price. The AWS platform has been optimized to provide a uniform solution for the transfer of wafers of most sizes and thicknesses. The utilization of vortex end effectors with our proprietary SoftTouch gripping mechanism ensures damage free wafer transfers between shipping containers and cassettes.
Support wafer jar pack/unpack with top approach available only